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  • 2020 /12/ 14

    XMC Rolls out New Brand "3DLink" for 3D IC Technology, Targeting Processing in Memory and 3D Sensor ToF

    The 3D IC technology developed by XMC has emerged as a major player in the market for many years, and has secured a stable position in some hot areas such as processing in memory, 3D sensor ToF, etc. Recently, XMC registered the 3D IC technology as a new brand "3DLink", and presented the details in the ICCAD 2020 in Chongqing.

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