2020 /12/ 14

XMC Rolls out New Brand "3DLink" for 3D IC Technology, Targeting High-speed Computing, In-Storage Computing and 3D Sensor ToF

The 3D IC technology developed by XMC has emerged as a major player in the market for many years, and has secured a stable position in some hot areas such as high-speed computing, in-storage computing, 3D sensor ToF, etc. Recently, XMC registered the 3D IC technology as a new brand "3DLink", and presented the details in the ICCAD 2020 in Chongqing.