Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC®), founded in Wuhan, China in 2006,has two 12-inch fabs, and is dedicated to becoming a reliable leader in semiconductor specialty technology. It focuses on developing 3D IC technology(3DLinkTM), specialty flash memory process, and CMOS specialty process platforms. XMC is committed to providing innovative products and world-class services to its global customers.

In the NOR Flash industry, XMC has more than ten years of 300mm manufacturing experience and is one of the leading specialty flash memory process manufacturers worldwide, with the mass production processes covering 65-45nm Mirror Bit and 65-50nm Floating Gate. Based on the process of FG 65-50nm, XMC has launched low-power and high-performance SPI NOR Flash products, with a product density ranging from 1 to 512Mbit, which have been widely used in various markets such as consumer, communication, industrial, computer and peripherals, etc.

XMC 3DLinkTM is an industry's leading 3D IC technology platform which enables direct bonding of multiple wafers or wafers to chips in a vertical direction utilizing semiconductor nanoscale-interconnection technology. This platform includes two-wafer stacking technology (S-stacking®), multi-wafer stacking technology (M-stacking®) and heterogeneous integration technology (Hi-stacking® , including 2.5D interposer), etc. In addition to significantly reducing chip size and achieving wafer-level interconnection, XMC 3DLinkTM technology can improve chip performance with faster I/O speed, higher bandwidth, lower latency and lower power consumption, providing a powerful turnkey solution for chips of sensor, optical communication, in-storage computing and high-performance computing, etc.

Based on 55/40nm generic logic process, XMC has been developing CMOS specialty technology platform in depth. Covering RFSOI, eFlash, SPAD, Pixel, BCD, HV and other specialty technologies, XMC CMOS specialty process platform provides customers with highly flexible and cost-effective solutions in applications such as RF front-end, MCU, ToF, CIS, power management and driver IC, etc.

XMC has always adhered to rigorous quality control and ESH management, and is certified with various international standard, such as IATF16949, ISO9001, ISO45001, ISO14001, QC080000, and SS-00259.

XMC has been leveraging the resources of the partners, to provide its global customers with high performance, high reliability, low power consumption and high cost-performance products and solutions.

For more information, please visit www.xmcwh.com.