XMC provides 12-inch wafer foundry services to global customers. It focuses on developing advanced specialty processes, including 3D IC technology(3DLink™), specialty flash memory process, and specialty logic process platform. XMC is committed to providing innovative products and world-class services to its global customers.

XMC 3DLink™ is an industry's leading 3D IC technology platform which enables direct bonding of multiple wafers or wafers to chips in a vertical direction utilizing semiconductor nanoscale-interconnection technology. This platform includes three technology categories, two-wafer stacking technology (S-stacking®), multi-wafer stacking technology (M-stacking®) and heterogeneous integration technology (Hi-stacking™). In addition to significantly reducing chip size and achieving wafer-level interconnection, XMC 3DLink™ technology can improve chip performance with faster I/O speed, higher bandwidth, lower latency and lower power consumption, providing a powerful solution for chips of sensor, high-speed computing and HBM, etc.

XMC, one of the world’s leading NOR Flash wafer manufacturers, has more than ten years of 300mm manufacturing experience, providing high-performance NOR Flash technologies from 65nm to 45nm.

XMC specialty logic process platform enables flexible device combinations such as mixed signals, RF, embedded flash, etc., providing customers with highly flexible and cost-effective solutions in applications such as logic, RF, PMIC, MCU and Pixel(CIS, ToF), etc.

XMC has built up two 300mm fabs, each with a capacity of over 30,000 wafers/month. Equipped with full 300mm wafer manufacturing equipments, the manufacturing quality standard of XMC’s two fabs meet the automotive quality management system(IATF16949).