XMC provides Known Good Die (KGD) products for custom system-in-package (SiP) or multi-chip package (MCP) solutions requiring NOR Flash memory.
- All XMC SPI NOR products are offered in KGD option
- XMC could support RDL (re-Distribution Layer) to meet customized pad layout
- Customized I/O number
- Complete testing for function, data retention, endurance, etc.
- Dedicated technical staff will work with KGD customers for their specific requirements
- Effective production control & planning to ensure longevity supply & support