In the digital & analog field, CMOS image sensor (CIS) process platform of XMC is able to provide full-flow manufacturing services, with a complete layout and leading technological strength. The platform is equipped with pixel process capability of 0.7μm and above, and backside-illuminated (BSI) and bonding processes that have been applied in stable mass production for many years. The performances of key process specifications like quantum efficiency, dynamic range, and dark current, are at the forefront of international industry. It provides wafer foundry services of high-performance and low-power CIS products for customers in consumer, industrial, medical, automotive and other application fields.

With complete intellectual property rights on independent control, XMC RF-SOI process has been successfully made mass production of 55nm products, which provide diversified device integration covering RF switches, low-noise amplifiers, antenna tuners, and power amplifiers. RF-SOI platform is highly competitive in terms of the device performance and are widely applied in wireless communication fields like smart phones due to lower insertion loss, higher gain, and etc.