XtackingTM Technology Platform
XMC XtackingTM technology is world's leading wafer-level 3D IC technology platform which is independently developed by XMC, utilizing semiconductor nanoscale interconnection technology to directly bond multiple wafers. In addition to significantly reducing chip size and achievingwafer-level interconnection, XMC XtackingTM technology can improve chip performance including faster I/O speed, higher bandwidth, lower latency and l ower power consumption.
With the technology evolving, chip size continues to shrink, and the traditional Moore's Law will encounter bottlenecks in two-dimensional planar structure. XMC XtackingTM technology will effectively solve this problem, making it the best choice beyond Moore's Law. XMC XtackingTM technology uses wafer-level interconnection technology to improve integration by reducing its pitch size. This technology will serve the markets that demand small size, multi-function, high bandwidth and lowpower products.
XMC, the first wafer manufacturer of image sensor by adopting TSV technology in China, began to develop its XtackingTM technology since 2012. With years of mass production experience, XMC has successfully developed hybrid bonding and multi-wafer stacking technology. The advantage of multi-wafer stacking technology is that it can combine different functional wafers such as logic, memory, sensor, etc. to offer various integration solutions with better product performance.