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- Date: 2016-04-08
(Simon Yang, president and CEO of XMC, addressed the International Memory IC Summit Forum and the Launching Ceremony of the Memory IC Base Project concurrently held on March 28, 2016. The following is the full text of his speech.)
Distinguished guests, colleagues and media friends,
First of all, I’d like to thank all of you for taking the time in your busy schedule to attend our launching ceremony in the morning and the International Memory IC Summit Forum in the afternoon, especially those who have endured a long journey.
We concurrently held this summit forum and the launching ceremony of the memory IC R&D and manufacturing base in the hope of bringing together leading figures and renowned experts from IC companies, universities, research institutions and financial investment firms, to jointly forecast and discuss the challenges and development directions of the memory IC industry.
Although our memory IC industry is still in its infancy, there are nevertheless rare historical opportunities.
Broadly speaking, with the advent of Internet of Things and intelligentization, the memory IC industry is enjoying an ever more important position. Whether it’s big data, cloud computing or the storage of people’s memorable moments, all these cannot do without memory chips. According to statistics and predictions from IBS, NAND and DRAM will enjoy an average annual growth of approximately 9% and 7% respectively in terms of total revenue over the next decade, both higher than the growth rate of logic and analog IC products. The memory IC sector will account for more than one third of the IC industry in terms of revenue.
From the perspective of memory IC technology, the ever growing NAND Flash is facing a technology transition from traditional 2D NAND to 3D NAND. Compared to 2D NAND, 3D NAND features better performance, lower power consumption and higher reliability. It will gradually replace 2D NAND and be widely used in computers, mobile phones, servers and other electronic products.
As we all know, China is the world’s largest IC market with more than 55% of the global market share. Memory IC is no exception. The growth of high volume commodity memory IC industry is an unavoidable passage to the increase of domestic IC chip production ratio at a fast pace.
We are committed to building a technology-driven, market-oriented and profitability-centric company with professionally managed world-class operations, to bringing technology and production closer to their markets, to creating more value, and eventual achieving breakthrough for China memory IC industry.
But we know that there is long and difficult road ahead. This will take time and requires the full support of like-minded industry players. Meanwhile, we are willing to carry out various forms of win-win cooperation.
As long as we remain broad-minded, do the right thing with the right people in the right direction and never give up, we will eventually succeed.
This summit forum will cover various cutting-edge technologies and processes in the memory IC industry as well as forecast the trends and challenges. I believe this summit forum and the launching ceremony will together provide an exchange and learning platform to contribute valuable ideas and suggestions to the development of China’s memory IC industry. I wish this year’s summit forum a great success!
Once again, I’d like to extend my heartfelt gratitude to all of you. I thank Spansion (now part of Cypress) and the Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS)for taking part in our joint technology research and development. I thank all our partners for their long-term trust and support! We are currently facing a historical opportunity. Let’s seize the opportunity to do great things together!